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Fanless System

eBOX630B

Fanless Embedded AI System with Intel® Core™ Ultra Processor, HDMI/DisplayPort, 4 LAN, 4 COM, 6 USB, 2 USB Type-C, and 9 to 60 VDC

Status : Available Datasheet (PDF)
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- Intel® Core™ Ultra processor (Meteor Lake-H)

- Multiple compute engines : CPU , GPU (Intel® Arc GPU by H SKU) and NPU (Intel® AI Boost)

 -Dual-channel DDR5-5600 SO-DIMM, up to 96GB

- 6 USB and 2 USB Type-C with DisplayPort support

- Supports multiple display interfaces with 1 HDMI 1.4b and 3 x DisplayPort (2 ports via USB Type-C)

- Three 2.5GbE LAN with TSN and 1 GbE

- Two 2.5" front-access swappable HDD/SSD and one M.2 Key M 2280

- Wide operating temperature range from -40°C to +60°C

- Wide power input range from 9 to 60 VDC

- Supports the OpenVINO™ toolkit for AI computing

 

CPU

Intel® Core™ Ultra 7 processor 155H (16 cores, 28W TDP)

Intel® Core™ Ultra 5 processor 125H (14 cores, 28W TDP)

Chipset

SoC integrated

System Memory

x 262-pin DDR5 5600 MHz SO-DIMM, non-ECC, up to 96GB total

BIOS

AMI

COM

2 x RS-232/422/485 with auto flow (COM1/2)

2 x RS-232 with auto flow (COM3/4)

USB

4 x USB 3.2 Gen2 (Type-A)

2 x USB 2.0 (Type-A)

1 x USB Type-C (DisplayPort/USB 10Gbps support)

1 x USB Type-C (DisplayPort/USB 10Gbs with 30W power delivery support)

Ethernet/PoE

3 x 10/100/1000/2500 Mbps Ethernet (Intel® I226-IT)

1 x 10/100/1000 Mbps Ethernet (Intel® I210-IT)

Display

1 x HDMI 1.4b (lockable)

1 x DisplayPort 1.4a

Digital I/O

1 x 8-CH TTL DIO with DB9 female connector (4-in/4-out)

Audio

N/A

Storage

2 x 2.5" swappable SSD/HDD drive bay (up to 9.5 mm height, RAID 0,1 supported)

Expansion

1 x full-size PCI Express Mini Card (USB + PCIe signal)

1 x M.2 Key E 2230 slot for Wi-Fi (USB 2.0 + PCIe signal)

1 x M.2 Key M 2280 slot for NVMe storage (PCIe x4 signal only)

Others

TPM 2.0

1 x ATX power switch

1 x Remote power switch

1 x Reset switch connector

1 x Front-access SIM slot

4 x Antenna opening

Power

9 to 60 VDC

1 x Phoenix-type VDC power input connector

Watchdog Timer

255 levels, 1 to 255 sec.

Construction

Aluminum extrusion and heavy-duty steel, IP40

Operating Temperature

-40°C to +70°C (-40°F to +158°F) with 0.7 m/s air flow (CPU: 15W TDP) (with W.T. DRAM and SSD)

-40°C to +60°C (-40°F to +140°F) with 0.7 m/s air flow (CPU: 28W TDP) (with W.T. DRAM and SSD)

Relative Humidity

10% to 95%, non-condensing

Shock

IEC 60068-2-27 2008 Table A.1 (with SSD: 50G, half-sine, and 11 ms duration)

MIL-STD-810H, Method 516.8, and Procedure I (with SSD: 40G, TP sawtooth, and 11 ms duration)

Vibration

IEC 60068-2-64 2019 (with SSD: 3Grm STD, random, 5 to 500 Hz, and 0.5 hr/axis )

MIL-STD-810H, Method 514.8, Category 20, and Figure 514.8C-2

Dimensions
(W x D x H)

250 x 170 x 60 mm (9.84" x 6.69" x 2.36")

Weight (net/gross)

2.4 kg (5.29 lb)/3.2 kg (7.0 lb)

Certifications

CE, FCC Class A, UKCA

EOS Support

Win 11 IoT, Linux

Software Support

N/A

Mounting

Wall mount kit

DIN-rail kit

 

 

- eBOX630B-U5-125H (P/N-E360630B00)

  Fanless embedded AI system with Intel® 125H, HDMI/DisplayPort, 4 LAN, 4 COM, 6 USB, 2 USB Type-C, and 9 to 60VDC

- eBOX630B-U7-155H (P/N- E360630B01)

  Fanless embedded AI system with Intel® 155H, HDMI/DisplayPort, 4 LAN, 4 COM, 6 USB, 2 USB Type-C, and 9 to 60VDC

- 2.5" SATA HDD

  256GB or above

- 2.5" SATA SSD

  100GB or above

- DDR5 SO-DIMM

  8GB to 32GB

- E29R129103

  Wall mount kit

- E29R129115

  DIN-rail kit

- 509000001500

  24V 120W power adapter

- Power cord

- Wi-Fi/LTE module